Foldable Flex and Thinned Silicon Multichip Packaging by John W. Balde (auth.), John W. Balde (eds.)

By John W. Balde (auth.), John W. Balde (eds.)

Foldable Flex and Thinned Silicon Multichip Packaging Technology provides newly rising tools used to make stacked chip programs within the so-called 2-1/2 D expertise (3-D in actual structure, yet interconnected merely during the circuits on folded flex). it's also getting used in unmarried chip applications the place the thinness of the chips and the flex substrate made applications considerably thinner than via the other potential.

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Extra resources for Foldable Flex and Thinned Silicon Multichip Packaging Technology

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This will improve final test yield and manufacturing costs. If justified, roll-to-roll high volume batch flex fabrication for the microvia core could be added to the manufacturing process and the result is a common way to build organic modules, cards and boards using the same technology in a single factory. 8 HIGH-END PACKAGING EXAMPLE At this point, it would be instructive to look at how one might want to package the multi-processing system shown in Figure 8. This system consists of the following inventory: Four CP chips with 4 processor cores per chip and a crossbar switch fabric.

In addition MLC involves the screening of high temperature refractory metal pastes for conductor paths and mechanical punching for layer-to-Iayer vias. This is in contrast to the photolithographic etching processes used for forming wires and the mechanical drilling, laser drilling or etching used to make organic vias. As a result of these fundamental differences in processing, MLC parts can not be made in the same factory as organic parts. Since the organic PWB business is much larger than the MLC business, very few organic packaging companies were ever willing to invest in the ceramic business.

Discarding one in four finished SCM or MCM assemblies, would be a costly penalty. So for Intel to make BBUL commercially viable for high volume 39 microprocessor parts, they will have to achieve very high processing yields and/or low cost repairability. 7 ALTERNATIVES TO SSUl Fortunately, there are other ways to achieve BBUL-like structures using flex techniques where the thin film layers are built-up on a glass substrate separately and tested before being joined to the chips. Now KGD can be mated to KGTFW (Known Good Thin Film Wires) and only the joining step has to have high yield.

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